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It can also be used as a solder replacement, for bonding heat-sensitive electronic components or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals or plastics. Each Master Bond grade of these formulations contains different types, shapes, sizes, volumes of highly conductive flakes, particles, spheres, granules to provide low volume resistivity for bonding, sealing, coating applications.RFI/EMI shielding materials and components provide exceptional EMC shielding solutions to address regulatory compliance and performance needs.

Other specific formulations can be suited for when ECAs are applied as a coating in electrostatic discharge or EMI shielding. Lower curing temperatures of ECAs will protect sensitive electronic components without compromising the functionality of the electronic assembly. TE Connectivity empowers engineers by designing and manufacturing sensor and connectivity solutions for our increasingly connected world. Still, some general characteristics include high electrical conductivity, good adhesion to a range of surfaces, and a relatively low curing temperature.United Kingdom (Deutsch, English) (Nederlands, français, English) (Português) (Български) (English, français) (简体中文, English) (čeština, English) (dansk, English) (eesti keel) (suomi, English) (français, English) (Deutsch, English) (magyar, English) (English) (English) (Italiano,English) (한국어) (latviešu) (lietuvių k. To create a strain gauge (a resistor that varies resistance as it is bent), you can lay down a coat of liquid tape on a piece of flexible plastic. One part heat curing systems cure rapidly at moderate temperatures, require no mixing, dispense smoothly, streamline processing while avoiding waste. Snap-cure frozen epoxies are also popular for the electronics industry; these products require freezer storage and cure once they reach room temperature.